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Hersteller
LEXSYSTEM
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NET-II | Intel Celeron J1900 | Bay Trail-D | 4 C / 4 T | 2 GHz | 2,4 GHz | 10 W | 4GB DDR3L 1333 | - | - | full-size *1 | 2242 B Key (SATA) | - | full-size *1 | - | - | GbE x3 | USB 3.2 Gen 1x1, USB 2.0 x3 | RS-232/422/485, Isolated RS-232/422/485 | VGA | 1 | - | 12...36 VDC | -20...+50°C | Fanless | DIN rail | 110 x 90 x 30mm | - | *1: the same slot |
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Hersteller
LEXSYSTEM
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NET-III | Intel Atom x6413E | Elkhart Lake | 4 C / 4 T | 1,5 GHz | 3 GHz | 9 W | 8GB LPDDR4x 3200 | - | - | - | 2242/3042 B Key (SATA) *1 | - | full-size | 2242/3042 B Key (USB 3.2 Gen 1, USB 2.0 + SIM) *1 | - | 2,5GbE x2 | USB 3.2 Gen 1x1 x2, USB 2.0 x2 | RS-232/422/485, RS-232 x3 | HDMI x2 | 2 | - | 9...24 VDC | -20...+60°C | Fanless | DIN rail, VESA 75 | 135 x 110 x 35mm | TPM 2.0 (Firmware), In-band ECC | *1: the same slot |
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Hersteller
LEXSYSTEM
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NET-III | Intel Celeron J6412 | Elkhart Lake | 4 C / 4 T | 2 GHz | 2, 6GHz | 10 W | 8GB LPDDR4x 3200 | - | - | - | 2242/3042 B Key (SATA) *1 | - | full-size | 2242/3042 B Key (USB 3.2 Gen 1, USB 2.0 + SIM) *1 | - | 2,5GbE x2 | USB 3.2 Gen 1x1 x2, USB 2.0 x2 | RS-232/422/485, RS-232 x3 | HDMI x2 | 2 | - | 9...24 VDC | -0...+60°C | Fanless | DIN rail, VESA 75 | 135 x 110 x 35mm | TPM 2.0 (Firmware) | *1: the same slot |
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Hersteller
LEXSYSTEM
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NET-III | Intel Celeron J6412 | Elkhart Lake | 4 C / 4 T | 2 GHz | 2, 6GHz | 10 W | - | SODIMM (DDR4 3200 max. 32GB) | - | - | 2242 B Key (PCIe 3.0 [x2]/SATA) | - | - | 2242/3042 B Key (PCIe 3.0 [x2]/USB 3.2 Gen 1) + nanoSIM | - | GbE x3 | USB 3.2 Gen 1x1 x2 | RS-232/422/485 x2 | HDMI x2 | 2 | - | 9...24 VDC | 0...+60°C | Fanless | DIN rail, VESA 75 | 135 x 110 x 35mm | TPM 2.0 (Firmware) | - |
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Hersteller
AAEON
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PICO-APL3-SEMI | Intel Celeron N3350 | Apollo Lake | 2 C / 2 T | 1,1 GHz | 2,4 GHz | 6 W | 4GB DDR3L | - | - | - | 2280 B Key (SATA) | eMMC 32GB onboard | - | 2230 E Key | - | GbE | USB 3.2 Gen 1x1 x2 | - | HDMI | 1 | - | 12 VDC | 0...+50°C | Fanless | Wallmount, DIN rail | 122 x 80 x 30mm | Optional: RS-232 x2, Audio Line-Out | Processor stepping F1 |
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Hersteller
LEXSYSTEM
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SKY2 | Intel Core i7-1185GRE | Tiger Lake UP3 | 4 C / 8 T | 1,8 GHz | 4,4 GHz | 15 W | - | SODIMM (DDR4 3200 max. 32GB) | 1 (SATA) *1 | - | 2242 M Key (PCIe 4.0 x4 / SATA) | - | - | 3042 B Key (PCIe 3.0 x1/USB 3.2 Gen 1x1, USB 2.0) + nanoSIM | - | 2.5 Gbe x3 | USB 3.2 Gen 1x1 x2, USB 2.0 x2 | RS232/422/485 x2 | HDMI x4 | 4 | - | 9...36 VDC | -20...+60°C | Fanless | DIN rail | 141 x 72 x 111 mm | - | *1: SATA kit required |
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Hersteller
LEXSYSTEM
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SKY2 | Intel Core i3-1115GRE | Tiger Lake UP3 | 2 C / 4 T | 2,2 GHz | 3,9 GHz | 15 W | - | SODIMM (DDR4 3200 max. 32GB) | 1 (SATA) *1 | - | 2242 M Key (PCIe 4.0 x4 / SATA) | - | - | 3042 B Key (PCIe 3.0 x1/USB 3.2 Gen 1x1, USB 2.0) + nanoSIM | - | 2.5 GbE x3, GbE | USB 3.2 Gen 1x1 x3, USB 2.0 x2 | RS232/422/485 x2 | HDMI | 1 | - | 12 VDC | -20...+60°C | Fanless | DIN rail | 141 x 72 x 111 mm | - | *1: SATA kit required |
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Hersteller
LEXSYSTEM
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SKY2 | Intel Core i7-1185GRE | Tiger Lake UP3 | 4 C / 8 T | 1,8 GHz | 4,4 GHz | 15 W | - | SODIMM (DDR4 3200 max. 32GB) | 1 (SATA) *1 | - | 2242 M Key (PCIe 4.0 x4 / SATA) | - | - | 3042 B Key (PCIe 3.0 x1/USB 3.2 Gen 1x1, USB 2.0) + nanoSIM | - | 2.5 GbE x3, GbE | USB 3.2 Gen 1x1 x3, USB 2.0 x2 | RS232/422/485 x2 | HDMI | 1 | - | 12 VDC | -20...+60°C | Fanless | DIN rail | 141 x 72 x 111 mm | - | *1: SATA kit required |
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Hersteller
LEXSYSTEM
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SKY2 | Core i5-1335UE | Raptor Lake | 2 PC + 8 EC / 12 T | 1,3 GHz | 4,5 GHz (PC), 3,3 GHz (EC) | 15 W | - | SODIMM (DDR5 5200 max. 32GB) | SATA | - | 2280 M Key (PCIe 4.0 [x4/SATA] ) | - | - | M.2 2242/3042 (PCIe 3.0 [x2]/USB3.2 Gen 2x1, USB 2.0) + nanoSIM | - | 2,5 GbE x4 | USB 3.2 Gen 2x1 x3, USB 2.0 x2 | RS232/422/485 x2 | HDMI | 1 | - | 9...36 VDC | -20...+50°C | Passive | DIN rail | 72 x 141 x 111 mm | - | PC: performance core, EC: efficient core |
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Hersteller
AAEON
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SRG-3352 | TI AM3352 | - | 1 C / 1T | 0,3 GHz | 0,8 GHz | - | 1GB DDR3L | - | - | - | - | eMMC 8GB onboard, microSD slot | full-size + microSIM | - | - | GbE x2 | USB 2.0, USB 2.0 Micro | RS485 x2 | - | 0 | - | 9...30VDC | 0...+60°C | Fanless | Wallmount, DIN rail | 144 x 100 x 44mm | - | - |
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Hersteller
AAEON
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SRG-3352C | TI AM3352 | - | 1 C / 1T | 0,3 GHz | 0,8 GHz | - | 1GB RAM | - | - | - | - | eMMC 8GB onboard, microSD slot | full-size + microSIM | - | - | GbE x2 | USB 2.0 x2 | RS-485, DB9 Connector x2 | - | 0 | - | 9...30 VDC | 0...+60°C | Fanless | Wallmount | 109 x 110 x 39mm | - | - |
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Hersteller
AAEON
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SRG-4858P | ARM Cortex A8 | - | 1 C / 1T | - | 0,8 GHz | - | 1GB DDR3L | - | - | - | - | eMMC 16GB onboard, microSD slot | full-size (USB 2.0 only) + microSIM | - | - | GbE x2 | USB 2.0 | RS- 485 x10 | - | 0 | - | 9...30 VDC | 0...+60°C | Fanless | Wallmount | 144 x 100 x 44mm | - | - |
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Hersteller
AAEON
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SRG-ACAN | TI AM3352 | - | 1 C / 1T | 0,3 GHz | 0,8 GHz | - | 1GB RAM | - | - | - | - | eMMC 8GB onboard, microSD slot | full-size + microSIM | - | - | GbE x2 | USB 2.0 x2 | RS-232/422/485 x2 | - | 0 | - | 9...30 VDC | 0...+60°C | Fanless | Wallmount | 109 x 110 x 39mm | - | - |
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Hersteller
AAEON
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SRG-ACAN | TI AM3352 | - | 1 C / 1T | 0,3 GHz | 0,8 GHz | - | 1GB RAM | - | - | - | - | eMMC 8GB onboard, microSD slot | full-size + microSIM | - | - | GbE x2 | USB 2.0 x2 | RS-232/422/485, CAN Bus x2 CH | - | 0 | - | 9...30 VDC | 0...+60°C | Fanless | Wallmount | 109 x 110 x 39mm | - | - |
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Hersteller
AAEON
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SRG-ADIO | TI AM3352 | - | 1 C / 1T | 0,3 GHz | 0,8 GHz | - | 1GB RAM | - | - | - | - | eMMC 8GB onboard, microSD slot | full-size + microSIM | - | - | GbE x2 | USB 2.0 x2 | - | - | 0 | - | 9...30 VDC | 0...+60°C | Fanless | Wallmount | 109 x 110 x 39mm | DI with galvanic isolation x4, DO with galvanic isolation x4, ADC x4 | - |
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Hersteller
AAEON
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SRG-APL | Intel Atom x5-E3940 | Apollo Lake | 4 C / 4 T | 1,6 GHz | 1,8 GHz | 9,5 W | 4GB LPDDR4 | - | - | - | - | eMMC 32GB onboard, microSD slot | full-size + SIM | 2230 E Key | - | GbE x2 | USB 3.2 Gen 1x1 x4 | - | HDMI | 1 | - | 12 VDC | 0...+60°C | Fanless | Wallmount, DIN rail | 80 x 95 x 64mm | - | - |
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Hersteller
AAEON
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SRG-APL | Intel Atom x5-E3940 | Apollo Lake | 4 C / 4 T | 1,6 GHz | 1,8 GHz | 9,5 W | 4GB LPDDR4 | - | - | - | - | eMMC 32GB onboard, microSD slot | full-size + SIM | 2230 E Key | - | GbE x2 | USB 3.2 Gen 1x1 x4 | - | HDMI | 1 | - | 12 VDC | 0...+60°C | Fanless | Wallmount, DIN rail | 80 x 95 x 64mm | Installed Wi-Fi/BT Module | - |
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Hersteller
AAEON
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SRG-IMX8P | NXP i.MX 8M Plus Quad | i.MX8M Plus | 4 C / 4 T | 0,8 GHz | 1,6 GHz | 2 W | 2 GB LPDDR4 1866MHz onboard | - | - | - | - | 16 GB eMMC onboard, micro-SD slot | full-size (USB 2.0) + SIM, full-size (USB 2.0) | - | - | GbE x2 | USB 3.2 Gen 1x1 x2 | RS-232/422/485 x2, CAN FD x2 | HDMI | 1 | - | 9...36 VDC | -20...+70°C | Fanless | Wallmount, DIN rail | 141 x 98 x 48 mm | TPM 2.0 | - |
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Hersteller
AAEON
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SRG-IMX8P | NXP i.MX 8M Plus Quad | i.MX8M Plus | 4 C / 4 T | 0,8 GHz | 1,6 GHz | 2 W | 4 GB LPDDR4 1866MHz onboard | - | - | - | - | 16 GB eMMC onboard, micro-SD slot | full-size (USB 2.0) + SIM, full-size (USB 2.0) | - | - | GbE x2 | USB 3.2 Gen 1x1 x2 | RS-232/422/485 x2, CAN FD x2 | HDMI | 1 | - | 9...36 VDC | -20...+70°C | Fanless | Wallmount, DIN rail | 141 x 98 x 48 mm | TPM 2.0 | - |
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Hersteller
AAEON
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SRG-IMX8P | NXP i.MX 8M Plus Quad | i.MX8M Plus | 4 C / 4 T | 0,8 GHz | 1,6 GHz | 2 W | 2 GB LPDDR4 1866MHz onboard | - | - | - | - | 16 GB eMMC onboard, micro-SD slot | full-size (USB 2.0) + SIM, full-size (USB 2.0) | - | - | GbE x2 | USB 3.2 Gen 1x1 x2 | RS-232/422/485 x2, CAN FD x2 | HDMI | 1 | - | 9...36 VDC | -20...+70°C | Fanless | Wallmount, DIN rail | 141 x 98 x 48 mm | TPM 2.0 | - |
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Hersteller
AAEON
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SRG-IMX8P | NXP i.MX 8M Plus Quad | i.MX8M Plus | 4 C / 4 T | 0,8 GHz | 1,6 GHz | 2 W | 4 GB LPDDR4 1866MHz onboard | - | - | - | - | 16 GB eMMC onboard, micro-SD slot | full-size (USB 2.0) + SIM, full-size (USB 2.0) | - | - | GbE x2 | USB 3.2 Gen 1x1 x2 | RS-232/422/485 x2, CAN FD x2 | HDMI | 1 | - | 9...36 VDC | -20...+70°C | Fanless | Wallmount, DIN rail | 141 x 98 x 48 mm | TPM 2.0 | - |
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Hersteller
LEXSYSTEM
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TASK | Intel Atom x7-E3950 | Apollo Lake | 4 C / 4 T | 1,6 GHz | 1,8 GHz | 12 W | - | SODIMM (DDR3L 1867 max. 8GB) | 1 (SATA) | full-size 1* | - | - | full-size + SIM, full-size *1 | - | - | GbE x2 | USB 3.2 Gen 1x1 x4 | RS-232 x6 | DVI-D, VGA | 2 | - | 9...36 VDC | -20...+70°C | Fanless | Desktop | 77x210x125mm | DI x4, DO x4 | *1: the same slot |
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Hersteller
LEXSYSTEM
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TASK | Intel Atom x7-E3950 | Apollo Lake | 4 C / 4 T | 1,6 GHz | 1,8 GHz | 12 W | - | SODIMM (DDR3L 1867 max. 8GB) | 1 (SATA) | full-size 1* | - | - | full-size + SIM, full-size *1 | - | - | GbE x2 | USB 3.2 Gen 1x1 x4 | RS-232 x6 | DVI-D, VGA | 2 | - | 9...36 VDC | -20...+70°C | Fanless | Desktop | 77x210x125mm | DI x4, DO x4 | *1: the same slot |
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Hersteller
TECHNEXION
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TEK3 | NXP i.MX6 UltraLite | n/a | n/a | n/a | n/a | n/a | n/a | 512MB onboard | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | 2x USB 2.0, USB OTG | Isolated RS-232 2x, Isolated Flex CAN 2.0B 2x | HDMI, VGA | 2 | Line-out, Mic-in, Line-in | 12V DC | 0...+50°C | n/a | Wallmount | 168x109x55mm | Isolated DIO 8x | - |
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Hersteller
TECHNEXION
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TEK3 | NXP i.MX6 UltraLite | n/a | n/a | n/a | n/a | n/a | n/a | 512MB onboard | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | 2x USB 2.0, USB OTG | RS232 x2 | HDMI, VGA | 2 | Line-out, Mic-in, Line-in | 12V DC | 0...+50°C | n/a | Wallmount | 168x109x55mm | 8x DIO, CAN bus | - |
