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Fabricant
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 512kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Fabricant
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Fabricant
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Fabricant
FLAIRMESH
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Class 1 | Bluetooth v5.2 | GPIO, I2C, SPI, UART | 1,7 - 3,6VDC | - | 12x22x2,2 mm | -40...+85°C | SMD | Yes | - | - | n/a |
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Fabricant
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Fabricant
HOPERF
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- | Bluetooth v4.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Fabricant
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Fabricant
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 11,2x15,1x2,6 mm | -20...+85°C | SMD | Yes | - | - | MSL 3 |
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Fabricant
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Fabricant
QUECTEL
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n/a | BLE 5.4 | I2C, I2S, SPI, UART | n/a | n/a | 20x15,6x2,35 mm | n/a | n/a | n/a | - | HCM010 | MSL 3 |
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Fabricant
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Fabricant
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Fabricant
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | No | - | HCM111Z | MSL 3 |
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Fabricant
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricant
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18,8x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricant
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 35x13,8x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricant
MICROCHIP
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n/a | n/a | SPI | n/a | n/a | 25x20x3,2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricant
MICROCHIP
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- | Bluetooth v5.0 | I2C, SPI, UART | 1,9 - 3,6VDC | - | 12x22x2,4 mm | -40...+85°C | SMD | Yes | - | - | MSL 1 |
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Fabricant
QUECTEL
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n/a | - | - | n/a | n/a | - | n/a | n/a | n/a | - | - | MSL 3 |
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Fabricant
QUECTEL
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n/a | - | Bluetooth, LCC | n/a | n/a | 16,5x13,3x2,3 mm | n/a | n/a | n/a | - | HC06 | MSL 3 |
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Fabricant
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 352kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Fabricant
IMST
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n/a | n/a | SPI, UART | n/a | n/a | 20x25x2,7 mm | n/a | n/a | n/a | - | iM222 | MSL 3 |
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Fabricant
MICROCHIP
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- | Bluetooth v4.1 | AIO, PIO, SPI, UART | 3,0 - 3,6VDC | 64kB | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | - | n/a |
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Fabricant
MICROCHIP
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Class 1 | Bluetooth v4.1 | GPIO, I2C, SPI, UART | 1,8 - 3,6VDC | - | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | RN4020 | n/a |
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Fabricant
DIGI INTERNATIONAL
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n/a | n/a | I2C, SPI, UART | n/a | n/a | 24,38x27,61 mm | n/a | n/a | n/a | - | Xbee 3 | n/a |
Les modules Bluetooth sont des modules de communication sans fil qui servent à transférer des données entre des appareils utilisant la technologie Bluetooth. Ces modules assurent la communication sans fil entre des appareils tels que smartphones, tablettes, ordinateurs, écouteurs, haut-parleurs et bien d'autres encore. Les modules Bluetooth peuvent être intégrés dans des appareils tels qu’écouteurs sans fil, haut-parleurs sans fil, montres intelligentes ou bracelets fitness.
Les modules Bluetooth sont utilisés dans de nombreuses applications telles que lecture de musique sans fil, connexion sans fil à des périphériques ou transfert de données sans fil entre appareils. Ces modules simplifient la connexion sans fil entre les appareils et permettent d’utiliser plus facilement les fonctions des appareils sans fil.
