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Fabricante
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 512kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Fabricante
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Fabricante
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Fabricante
FLAIRMESH
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Class 1 | Bluetooth v5.2 | GPIO, I2C, SPI, UART | 1,7 - 3,6VDC | - | 12x22x2,2 mm | -40...+85°C | SMD | Yes | - | - | n/a |
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Fabricante
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Fabricante
HOPERF
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- | Bluetooth v4.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Fabricante
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Fabricante
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 11,2x15,1x2,6 mm | -20...+85°C | SMD | Yes | - | - | MSL 3 |
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Fabricante
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Fabricante
QUECTEL
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n/a | BLE 5.4 | I2C, I2S, SPI, UART | n/a | n/a | 20x15,6x2,35 mm | n/a | n/a | n/a | - | HCM010 | MSL 3 |
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Fabricante
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Fabricante
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Fabricante
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | No | - | HCM111Z | MSL 3 |
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Fabricante
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricante
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18,8x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricante
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 35x13,8x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricante
MICROCHIP
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n/a | n/a | SPI | n/a | n/a | 25x20x3,2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Fabricante
MICROCHIP
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- | Bluetooth v5.0 | I2C, SPI, UART | 1,9 - 3,6VDC | - | 12x22x2,4 mm | -40...+85°C | SMD | Yes | - | - | MSL 1 |
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Fabricante
QUECTEL
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n/a | - | - | n/a | n/a | - | n/a | n/a | n/a | - | - | MSL 3 |
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Fabricante
QUECTEL
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n/a | - | Bluetooth, LCC | n/a | n/a | 16,5x13,3x2,3 mm | n/a | n/a | n/a | - | HC06 | MSL 3 |
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Fabricante
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 352kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Fabricante
IMST
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n/a | n/a | SPI, UART | n/a | n/a | 20x25x2,7 mm | n/a | n/a | n/a | - | iM222 | MSL 3 |
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Fabricante
MICROCHIP
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- | Bluetooth v4.1 | AIO, PIO, SPI, UART | 3,0 - 3,6VDC | 64kB | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | - | n/a |
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Fabricante
MICROCHIP
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Class 1 | Bluetooth v4.1 | GPIO, I2C, SPI, UART | 1,8 - 3,6VDC | - | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | RN4020 | n/a |
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Fabricante
DIGI INTERNATIONAL
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n/a | n/a | I2C, SPI, UART | n/a | n/a | 24,38x27,61 mm | n/a | n/a | n/a | - | Xbee 3 | n/a |
Los módulos Bluetooth son módulos de comunicación inalámbrica que se utilizan para transferir datos entre dispositivos mediante la tecnología Bluetooth. Estos módulos permiten la comunicación inalámbrica entre dispositivos como teléfonos inteligentes, tabletas, ordenadores, auriculares o altavoces, entre muchos otros. Los módulos Bluetooth pueden integrarse en dispositivos como auriculares inalámbricos, altavoces inalámbricos, relojes inteligentes o pulseras de fitness.
Los módulos Bluetooth se utilizan en muchas aplicaciones, como la reproducción inalámbrica de música, la conexión inalámbrica a dispositivos periféricos o la transferencia inalámbrica de datos entre dispositivos. Estos módulos garantizan una conexión fácil e inalámbrica entre dispositivos y facilitan a los usuarios el uso de las funciones de los dispositivos inalámbricos.
