Modules come with 12 year longevity TechNexion commitment and revision control (4 year active product development, 7 year mature product supply and 1 year last shipment), which means end of life 2026 for PICO-iMX6UL, PICO-iMX6 and 2027 for PICO-iMX7.
PICO modules are supplied with or without Wi-Fi 802.11ac/Bluetooth LE 4.0 combo module. They provide onboard eMMC / microSD / NAND FLASH / NOR QSPI FLASH storage. Modules based on quad core i.MX6 processor also provide SATA 2 (3.0 Gbit/s interface). Depending on the processor, they provide 1Gbit (10/100Mbit) MAC with RGMII (RMII) interface. Ethernet PHY is not integrated on module, it is placed on the carrier board. For more information about available options please see PICO modules overview and datasheets.
Modules use proprietary 36x40mm form factor with three 70-pin expansion connectors on the bottom side and U.FL antenna connector on the top side. If necessary, provided heatsink can be used.
Modules can be immediately used with Hobbit, Nymph or Dwarf carrier board. Customers can also design their own carrier board optimized for his application using freely available schematic files. Depending on required interfaces, advanced PCB design skills are required for routing high-speed interfaces such as PCI-Express, SATA 2, RGMII, RMII, HDMI, LVDS/TTL RGB display output or USB 2.0 high speed.
All PICO modules come with source code (Linux kernel, u-boot, Android, Yocto Linux) and binary demo images (Android, Yocto Linux, Ubuntu Linux).
For further information about TechNexion products please look at our TechNexion web pages or contact us at sales@soselectronic.com.
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