Notice
You are currently browsing the website for customers from Holy See (Vatican City State). We recommend switching to the United States version of the site, optimized for your region.
Manufacturer
TECHNEXION
|
TC-0700 | 7" | 1024 x 600 | 500 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX6DL | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3 | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE | USB 2.0, USB OTG | Isolated RS232/422/485, RS232, isolated Flex CAN x2 | HDMI | 2 | 2x2W/8OHm | 10...30V DC, PoE 802.3at | n/a | 0...+50°C | n/a | VESA 75x35 | 184 x 122 x 30mm | Plastic front frame, metal enclosure | 4x DIO, isolated | - | - | 1GHz | microSD | 16GB eMMC | 2x Cortex A9 |
Manufacturer
TECHNEXION
|
TC-0710 | 7" | 1024 x 600 | 500 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX6DL | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3 | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE | USB 2.0, USB OTG | Isolated RS232/422/485, RS232, isolated Flex CAN x2 | HDMI | 2 | 2x2W/8OHm | 10...30V DC or PoE 802.3at | n/a | 0...+50°C | n/a | VESA 75x35 | 184 x 122 x 30mm | IP65 aluminium front frame, metal enclosure | 4x DIO, isolated | - | Wi-Fi 802.11bgn BT 4.0 ext. ant. | 1GHz | microSD | 16GB eMMC | 2x Cortex A9 |
Manufacturer
TECHNEXION
|
TEP-0500 | 5" | 800 x 480 | 350 cd/m2 | 150° H, 145 °V | PCAP multi-touch 10-point | NXP i.MX6UL | n/a | n/a | n/a | n/a | n/a | n/a | 512MB DDR3 | n/a | n/a | n/a | n/a | n/a | n/a | n/a | 100MbE x2 | USB 2.0, USB OTG | RS232 x4, FlexCAN x2 | - | 1 | Int. header - 2x2W/8Ohm | 12V DC | n/a | 0...+50°C | n/a | Panel, VESA 75x35 | 150 x 106 x 40mm | IP65 aluminium front frame, metal enclosure | 12x DIO | - | - | 528MHz | - | 4GB eMMC, microSD | 1x Cortex A7 |
Manufacturer
TECHNEXION
|
TEP-0500 | 5" | 800 x 480 | 500 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX7D | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3L | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | USB 2.0, USB OTG | RS232 x2, FlexCAN x2 | - | - | - | 8...36V DC | n/a | 0...+50°C | n/a | VESA 75x35 | 150,3 x 105,6 x 39,5mm | IP65 aluminium front frame, metal enclosure | 8x DIO | - | - | 1,2GHz, 200MHz | M.2 2242 B key, SIM | 4GB eMMC | 2x Cortex A7 + Cortex M4 |
Manufacturer
TECHNEXION
|
TEP-0500 | 5" | 800 x 480 | 500 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX7D | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3L | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | USB 2.0, USB OTG | RS232 x2, FlexCAN x2 | - | - | - | 12V DC or PoE 802.3at | n/a | 0...+50°C | n/a | VESA 75x35 | 150,3 x 105,6 x 39,5mm | IP65 aluminium front frame, metal enclosure | 8x DIO | - | - | 1,2GHz, 200MHz | M.2 2242 B key, SIM | 4GB eMMC, microSD | 2x Cortex A7 + Cortex M4 |
Manufacturer
TECHNEXION
|
TEP-0700 | 7" | 800 x 480 | 350 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX6UL | n/a | n/a | n/a | n/a | n/a | n/a | 512MB DDR3 | n/a | n/a | n/a | n/a | n/a | n/a | n/a | 100MbE x2 | USB 2.0, USB OTG | RS232 x4, FlexCAN x2 | - | 1 | Int. header - 2x2W/8Ohm | 12V DC | n/a | 0...+50°C | n/a | Panel, VESA 75x35 | 199 x 136 x 52mm | IP65 aluminium front frame, metal enclosure | 12x DIO | - | - | 528MHz | - | 4GB eMMC, microSD | 1x Cortex A7 |
Manufacturer
TECHNEXION
|
TEP-0700 | 7" | 800 x 480 | 350 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX7D | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3L | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | USB 2.0, USB OTG | RS232 x4, FlexCAN x2 | - | 1 | - | 9...36V DC | n/a | 0...+50°C | n/a | VESA 75x35 | 198,5 x 136,3 x 50,5mm | IP65 aluminium front frame, metal enclosure | 12x DIO | - | - | 1,2GHz, 200MHz | M.2 2242 B key, SIM | 4GB eMMC, microSD | 2x Cortex A7 + Cortex M4 |
Manufacturer
TECHNEXION
|
TEP-0700 | 7" | 800 x 480 | 500 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX7D | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3L | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | USB 2.0, USB OTG | RS232 x4, FlexCAN x2 | - | - | - | 12V DC, PoE 802.3at | n/a | 0...+50°C | n/a | VESA 75x35 | 198,5 x 136,3 x 50,5mm | IP65 aluminium front frame, metal enclosure | 12x DIO | - | - | 1,2GHz, 200MHz | M.2 2242 B key, SIM | 4GB eMMC, microSD | 2x Cortex A7 + Cortex M4 |
Manufacturer
TECHNEXION
|
TEP-0700 | 7" | 800 x 480 | 350 cd/m2 | 150° H, 145° V | PCAP multi-touch 10-point | NXP i.MX7D | n/a | n/a | n/a | n/a | n/a | n/a | 1GB DDR3L | n/a | n/a | n/a | n/a | n/a | n/a | n/a | GbE x2 | USB 2.0, USB OTG | RS232 x4, FlexCAN x2 | - | 1 | - | 9...36V DC | n/a | 0...+50°C | n/a | VESA 75x35 | 198,5 x 136,3 x 50,5mm | IP65 front frame, brushed anodized aluminium | 12x DIO | - | - | 1,2GHz, 200MHz | M.2 2242 B key, SIM | 16GB eMMC, microSD | 2x Cortex A7 + Cortex M4 |