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Hersteller
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 512kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Hersteller
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Hersteller
FLAIRMESH
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Class 1 | Bluetooth v5.2 | GPIO, I2C, SPI, UART | 1,7 - 3,6VDC | - | 12x22x2,2 mm | -40...+85°C | SMD | Yes | - | - | n/a |
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Hersteller
FLAIRMESH
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Hersteller
QUECTEL
|
- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Hersteller
HOPERF
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- | Bluetooth v4.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Hersteller
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Hersteller
HOPERF
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- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 11,2x15,1x2,6 mm | -20...+85°C | SMD | Yes | - | - | MSL 3 |
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Hersteller
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Hersteller
QUECTEL
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n/a | BLE 5.4 | I2C, I2S, SPI, UART | n/a | n/a | 20x15,6x2,35 mm | n/a | n/a | n/a | - | HCM010 | MSL 3 |
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Hersteller
QUECTEL
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n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Hersteller
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Hersteller
QUECTEL
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- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512kB | 15,0x12,0x2,25 mm | -40...+85°C | SMD | No | - | HCM111Z | MSL 3 |
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Hersteller
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Hersteller
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 18,8x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Hersteller
MICROCHIP
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n/a | n/a | UART | n/a | n/a | 35x13,8x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Hersteller
MICROCHIP
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n/a | n/a | SPI | n/a | n/a | 25x20x3,2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
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Hersteller
MICROCHIP
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- | Bluetooth v5.0 | I2C, SPI, UART | 1,9 - 3,6VDC | - | 12x22x2,4 mm | -40...+85°C | SMD | Yes | - | - | MSL 1 |
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Hersteller
QUECTEL
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n/a | - | - | n/a | n/a | - | n/a | n/a | n/a | - | - | MSL 3 |
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Hersteller
QUECTEL
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n/a | - | Bluetooth, LCC | n/a | n/a | 16,5x13,3x2,3 mm | n/a | n/a | n/a | - | HC06 | MSL 3 |
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Hersteller
QUECTEL
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- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8V | 352kB | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | 1 |
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Hersteller
IMST
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n/a | n/a | SPI, UART | n/a | n/a | 20x25x2,7 mm | n/a | n/a | n/a | - | iM222 | MSL 3 |
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Hersteller
MICROCHIP
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- | Bluetooth v4.1 | AIO, PIO, SPI, UART | 3,0 - 3,6VDC | 64kB | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | - | n/a |
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Hersteller
MICROCHIP
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Class 1 | Bluetooth v4.1 | GPIO, I2C, SPI, UART | 1,8 - 3,6VDC | - | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | RN4020 | n/a |
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Hersteller
DIGI INTERNATIONAL
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n/a | n/a | I2C, SPI, UART | n/a | n/a | 24,38x27,61 mm | n/a | n/a | n/a | - | Xbee 3 | n/a |
Bluetooth-Module sind drahtlose Kommunikationsmodule, die der Datenübertragung zwischen Geräten mithilfe der Bluetooth-Technologie dienen. Diese Module ermöglichen die drahtlose Kommunikation zwischen Geräten wie Smartphones, Tablets, Computern, Kopfhörern, Lautsprechern u.v.m. Bluetooth-Module können in Geräte wie drahtlose Kopfhörer, drahtlose Lautsprecher, Smartwatches oder Fitnessarmbänder integriert werden.
Bluetooth-Module kommen in vielen Anwendungen zum Einsatz, beispielsweise bei der drahtlosen Wiedergabe von Musik, der drahtlosen Verbindung zu Peripheriegeräten oder der drahtlosen Datenübertragung zwischen Geräten. Diese Module gewährleisten eine einfache drahtlose Verbindung zwischen Geräten und erleichtern die Nutzung von Funktionen drahtloser Geräte.
